MediaTek Dimensity and Helio chipsets: 5G, AI, and connected device platforms for global markets.
MediaTek announced the successful implementation of the global software security model Building Security In Maturity Model (BSIMM12), making it the first company in Taiwan to…
The T750 is a highly integrated, 7nm compact chipset design with an integrated 5G radio and quad-core Arm CPU. It’s full-featured with all the…
MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the…
MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network…
Global technology leader Xiaomi today announced the introduction of three new smartphones to the Xiaomi 11 family of devices – Xiaomi 11T, Xiaomi 11T Pro – all…
HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio™ 900T chipset, expanding MediaTek’s portfolio of mobile computing solutions for tablets, portable notebooks,…
Xiaomi today launched Redmi 10. Following up with a full suite of major upgrades compared with its predecessor, Redmi 10 touts the series’ first…
MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the…
Hello All,Ces derniers jour de nombreuses rumeurs concernant un Dimensity Très haut de gamme dédié au Gaming : Dimensity 1300T.Après que Mediatek ait démenti…
MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process…
Hello tout le monde, Je prends un peu du temps de libre que j’ai pour partager (ou re partager, ou re poster) un tutoriel à jour…
MediaTek today announced two additions to its Helio G series: Helio G96 and Helio G88. The launch of these system-on-chips (SoCs) will give device makers…
MediaTek announced the Dimensity 5G Open Resource Architecture that provides brands with more flexibility to customize key 5G mobile device features to address different market…
MediaTek, the world’s fourth-largest fabless semiconductor company, today announced its collaboration with Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for…
China Mobile will join forces with HP, Intel and MediaTek to collaborate on 5G-enabled PCs for the next-generation of connected modern PC experiences. Since…
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