Huawei Pulled the Ascend 960DT Forward Three Quarters. The Optics Matter More Than the Date.
Huawei's Ascend 960DT now lands in Q1 2027 and the 960PR in Q3, feeding a 4,096-NPU Atlas 960E SuperPoD built on near-packaged optics. The…
Semiconductor industry: chip design, fabs, TSMC, Intel, NVIDIA, and global supply chain.
Huawei's Ascend 960DT now lands in Q1 2027 and the 960PR in Q3, feeding a 4,096-NPU Atlas 960E SuperPoD built on near-packaged optics. The…
China's Institute of Microelectronics reports a significant 500,000 on-off current ratio for a new gate-all-around transistor using deep ultraviolet lithography. However, this measure alone…
Axelera Europa is now shipping in validated Dell and Supermicro systems and heading into the EU AI Factories in Italy and Luxembourg. The 629…
The ASUS Ascent QN10 is the first Snapdragon X2 Elite mini PC you can actually buy, at $1,349. Eighteen Oryon cores and an 80…
Qualcomm has unveiled its next flagship mobile chip architecture, highlighting three main components: the Oryon CPU reaching 5GHz, Adreno GPU incorporating AI-dedicated units, and…
Samsung's 2nm process has improved yield rates, surpassing 70 percent, yet Qualcomm remains hesitant to partner due to a 15 percent price hike by…
MediaTek launched its Dimensity 9600 Pro, the first mobile chip using TSMC's 2nm process, aiming to capture market share from Qualcomm. As both companies…
Kepler Computing, after seven years in stealth, claims to solve memory scarcity without extreme ultraviolet lithography. Backed by significant funding, the company utilizes a…
Three weeks after TSMC SVP Kevin Zhang opted against the High-NA EUV tool for the A14 node, TSMC announced a joint initiative with ASML…
Mistral secured three billion euros in its latest funding round, surpassing a twenty-one billion valuation, the highest for any European tech company. Led by…
UBS estimates that China's lithography technology is significantly behind, comparable to ASML in 2004, with no viable EUV alternative expected within a decade. However,…
The Kirin 9050 Pro is the first chip built on Huawei's LogicFolding: two active silicon layers bonded face to face by 50 million vertical…
Ytterbium ions are now utilized in Jülich, Germany, with the launch of the JION quantum computer, supported by significant funding. Meanwhile, Copenhagen plans a…
At the UGREEN HomeAgent launch at Gillette Stadium, various NAS products were showcased, including three models—HA100, HA100 Pro, and MasterAgent MA100—featuring distinct processors. The…
Nvidia is putting $3.5 billion into MediaTek convertible bonds, and the real story isn't the investment, it's MediaTek building its next hyperscaler chips on…
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