SMIC 14nm: China Climbs the FinFET Cliff
SMIC 14nm was China's first homegrown FinFET, architected by Liang Mong Song and built for Huawei, proving SMIC could do leading-edge engineering at last.
SMIC 14nm was China's first homegrown FinFET, architected by Liang Mong Song and built for Huawei, proving SMIC could do leading-edge engineering at last.
Intel 10nm arrived four years late after the 14nm purgatory, and in the delay TSMC passed Intel for good. The node where Intel lost…
Samsung 7nm EUV produced the Exynos 9825, the first commercial chip built with extreme ultraviolet lithography, as Samsung raced TSMC into the EUV era.
A year ago I said a press release with five logos does not lay fiber. The first Open Fronthaul specification just landed at Barcelona,…
TSMC's 7nm node shipped the first 7nm chip in the A12, anchored AMD's comeback against Intel, and watched GlobalFoundries quit the leading edge, leaving…
AT&T and China Mobile just co-founded the same alliance. The xRAN Forum and the C-RAN Alliance are merging into the O-RAN Alliance, and the…
Give a workshop in Shenzhen, one of MediaTek’s complete phone kits, the chip already sitting on a reference board with the firmware and test…
A Stanford professor and two tier-one operators just launched a forum to turn the radio access network into open software running on ordinary servers.…
SMIC 28nm reached volume in 2015, four years late after a long yield struggle, just as the leading edge moved to FinFET and left…
Quantum startups begin appearing in France in the mid-to-late 2010s as research translates into early commercial efforts in computing and communication.
France strengthens its AI position through sustained research output, startup activity, and corporate programs that align in the mid-2010s.
Intel 14nm arrived late in Broadwell, the first schedule slip in a decade. The node was still the best in the world, but the…
Qualcomm announced the Snapdragon 810 and 808 this week, and the most revealing thing in the spec sheet is what is missing. There is…
Samsung's 32nm gate-first HKMG process die-shrank the Apple A5 in 2012 and powered Samsung's own Galaxy S III, deepening the foundry bond even as…
TSMC's 28nm node brought gate-last high-k metal gate just as every mobile chip designer arrived at once, triggering a capacity crunch, while Intel's Tri-Gate…