CATEGORY_INDEX // 70 ENTRIES

Foundry

Infographic titled China's CPU Industry: Fabless by Force, showing chip brands Loongson, HiSilicon, Hygon, Zhaoxin, and Phytium across x86, Arm, and LoongArch architectures
AI · 07/02/2026

China’s CPU Industry Is Fabless by Force

The article discusses the challenges faced by Chinese CPU companies due to reliance on foreign technology and sanctions. It outlines five key players navigating…

8 MIN
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m1k.tech article cover: SMIC Shanghai – The Founding Bet, with a futuristic semiconductor fab illustration
CHIPS & AI · 06/29/2026

SMIC in 2005: The Bet That the Door Would Stay Open

In 2005, SMIC, China’s semiconductor champion, faced a dramatic journey, building advanced fabs with foreign technology while accumulating losses. Despite early successes and optimism…

6 MIN
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Intel 14A: The Node That Needs a Customer — infographic highlighting key technologies: High-NA EUV, RibbonFET, and Backside PowerVia, split between internal and foundry use cases
CHIPS & AI · 01/15/2026

Intel 14A: The Node That Needs a Customer

Intel 14A uses High-NA EUV and may not be built at all unless outside foundry customers commit, the node where Intel Foundry either becomes…

4 MIN
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Intel 20A process node featuring RibbonFET and PowerVia technologies, shown with a stylized chip illustration
CHIPS & AI · 09/16/2024

Intel 20A: The Node Intel Cancelled

Intel 20A was the leadership node carrying RibbonFET and PowerVia, until Intel cancelled it in 2024 to save 18A, and built Arrow Lake at…

4 MIN
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Intel 3: The First Foundry Node — m1k.tech article header with a glowing circuit board illustration
CHIPS & AI · 06/04/2024

Intel 3: The First Node Built to Be Sold

Intel 3 marks a pivotal point in Intel's strategy, serving as its first foundry node designed for external customers. As the company aims to…

4 MIN
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SMIC 5nm Pushing DUV Past Reason — milk.tech article cover with a glowing circuit board illustration
AI · 05/20/2024

SMIC 5nm: Pushing DUV Past Reason

SMIC 5nm means leading-edge logic on DUV at punishing cost, driven by China's need to build Huawei's Ascend AI chips after the US banned…

4 MIN
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Infographic: Intel 4 EUV Meteor Lake chiplet arrives 2024, a decade after TSMC (2018) and Samsung (2018) reached comparable nodes, calling it progress but lost leadership and market momentum despite heavy R&D investment
CHIPS & AI · 12/14/2023

Intel 4: EUV Arrives a Decade Late

Intel 4 is the company's first EUV node, in Meteor Lake, finally adopting the lithography Intel refused at 10nm and that the foundries shipped…

3 MIN
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Infographic on SMIC 7nm Kirin 9000S chip powering the Huawei Mate 60 Pro despite U.S. export sanctions, made via DUV multipatterning without EUV; highlights U.S. policy capping China at 14nm and text "The Embargo Leaked
CHIPS & AI · 09/05/2023

SMIC 7nm: The Mate 60 Shock

SMIC 7nm shipped in the Huawei Mate 60 Pro's Kirin 9000S, a DUV-built chip that proved export controls could not cap China at 14nm.…

4 MIN
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