In 2005, SMIC, China’s semiconductor champion, faced a dramatic journey, building advanced fabs with foreign technology while accumulating losses. Despite early successes and optimism…
Qualcomm's Snapdragon X2 Elite shipped this spring and the reviews are in: up to 18 cores at 5.0 GHz, an 80 TOPS NPU, and…
The ASML lithography monopoly is the most complete chokepoint in tech. High-NA in fabs, Hyper-NA ahead, China capped, one company holding it all up.…
TSMC's A16 node brings backside power delivery (Super Power Rail) in 2026, answering Intel's 18A and opening the angstrom era for AI and HPC…
Intel showcased advancements in their 18A-P node at the VLSI Symposium, achieving enhanced performance and reduced power consumption. Key features include improved thermal resistance…
Reasoning models are measurably smarter. The real question is who controls the infrastructure they run on, and whether better reasoning creates value or creates…
Qualcomm expands compute architecture to desktops with the X2 Elite, splits mobile silicon into standard and Pro tiers, and pushes toward a $6B automotive…
The AI chip war isn't won by the loudest GPU launches. It's won by the infrastructure nobody talks about: the CPUs running the orchestration…
The post details the rapid advancement of AI from 2023 to 2026, highlighting significant investments, partnerships, and innovations in infrastructure, robotics, and consumer devices,…
In 2026, storage prices are rising due to DRAM and NAND shortages, pushing some companies toward failure. Most brands are assemblers rather than manufacturers,…
The evolution of edge AI processing from the Myriad 2's 100 gigaflops to the Dragonwing Q-8750's 77 TOPS illustrates a shift towards powerful, local…
Intel 14A uses High-NA EUV and may not be built at all unless outside foundry customers commit, the node where Intel Foundry either becomes…
Intel 18A brings RibbonFET and PowerVia backside power to Panther Lake, a genuine leadership feature, just as the CEO who bet everything on it…
Samsung 2nm, the SF2 node behind the Exynos 2600, is the company's comeback bid: a third-generation gate-all-around process against TSMC N2 and Intel.
TSMC's 2nm node brings gate-all-around nanosheets at last, three years after Samsung, into the first real leading-edge fight with Intel's 18A in a decade.
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