Three weeks after TSMC SVP Kevin Zhang opted against the High-NA EUV tool for the A14 node, TSMC announced a joint initiative with ASML…
Intel's recent $20 billion stock offering, upsized from an initial $15 billion target, reflects its push into chip manufacturing amidst rising demand. The company's…
Elon Musk announced SpaceX's exclusive partnership with Nvidia during an earnings call, securing advanced hardware for AI satellite operations. SpaceX disclosed significant investments in…
Five years ago, creating a 7nm-class chip without EUV was deemed irrational. SMIC achieved it, but claims about its N+3 node density remain unverified.…
TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…
NVIDIA's acquisition of TSMC's CoWoS capacity creates a competitive bottleneck in AI infrastructure, prompting Intel to leverage its EMIB technology. Google’s ninth-generation TPU utilizes…
Huawei's LogicFolding uses 1.5µm hybrid bonding to hit 238M transistors/mm² on 7nm DUV — redefining what packaging can do without EUV.
Zhaoxin, a joint venture with VIA Technologies, holds a unique position as China's lone x86 chipmaker without U.S. sanctions. Despite being behind in technology,…
Hygon, a Chinese server chip manufacturer, evolved from a 2017 AMD EPYC architecture, leveraging a 2016 licensing deal. Despite U.S. sanctions halting new IP…
The Morefine M700S mini PC, powered by the Loongson 3A6000 processor, marks a significant achievement for Chinese silicon. Loongson's commitment to a self-designed ISA…
Keller welcomes the Cerebras IPO, then bets cheap DRAM and open RISC-V beat it on cost. The real prize is the CPU Qualcomm is…
In 2005, SMIC, China’s semiconductor champion, faced a dramatic journey, building advanced fabs with foreign technology while accumulating losses. Despite early successes and optimism…
Qualcomm's Snapdragon X2 Elite shipped this spring and the reviews are in: up to 18 cores at 5.0 GHz, an 80 TOPS NPU, and…
The ASML lithography monopoly is the most complete chokepoint in tech. High-NA in fabs, Hyper-NA ahead, China capped, one company holding it all up.…
TSMC's A16 node brings backside power delivery (Super Power Rail) in 2026, answering Intel's 18A and opening the angstrom era for AI and HPC…
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