Huawei's Ascend 960DT now lands in Q1 2027 and the 960PR in Q3, feeding a 4,096-NPU Atlas 960E SuperPoD built on near-packaged optics. The…
The Kirin 9050 Pro is the first chip built on Huawei's LogicFolding: two active silicon layers bonded face to face by 50 million vertical…
Tim Cook's recent departure from his CEO role at Apple marks a significant transition, with John Ternus stepping in. Cook's tenure, focused on operational…
Apple is testing DRAM chips from ChangXin Memory Technologies, a Chinese supplier flagged by the Trump administration for military ties, amid a global memory…
Five years ago, creating a 7nm-class chip without EUV was deemed irrational. SMIC achieved it, but claims about its N+3 node density remain unverified.…
The Casablanca court granted Africa's first standard-essential patent injunction against Transsion's Tecno and Itel, leading to a swift global settlement with Ericsson. This ruling…
China's yuan-denominated integrated circuit exports surged 88.7% in early 2025, driven by global AI demand, though currency depreciation and outsourced assembly inflate figures. Despite…
The upcoming World Radiocommunication Conference in Shanghai will be significant for 6G spectrum allocation, with the U.S. leading a coalition of over twenty nations…
Huawei recently unveiled its new laptop processors, Kirin X90 Plus and XE90, at a HarmonyOS event in China. The chips refine existing designs but…
Taiwan has detained Nvidia employee Chang amid a smuggling investigation linked to Super Micro's operations, involving alleged falsification of export documents for AI chips…
Over fifteen years, the Open RAN initiative evolved from a China Mobile white paper to a $10 billion movement, yet the RAN market has…
Viettel has become the first company in Qualcomm's 6G Early Access Program, signaling a significant partnership. While focused on 6G, the real impact lies…
Huawei's LogicFolding uses 1.5µm hybrid bonding to hit 238M transistors/mm² on 7nm DUV — redefining what packaging can do without EUV.
Huawei says folding chips in 3D routes around US sanctions. One month later IBM showed a validated 0.7nm nanostack, going further on better tools.…
Zhaoxin, a joint venture with VIA Technologies, holds a unique position as China's lone x86 chipmaker without U.S. sanctions. Despite being behind in technology,…
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