TSMC’s CoWoS Outsourcing Is Nvidia’s Fault, and the OSATs Saw It Coming First
TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…
Intel processors, chipsets, and semiconductor technology: from Core to Panther Lake.
TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…
NVIDIA's acquisition of TSMC's CoWoS capacity creates a competitive bottleneck in AI infrastructure, prompting Intel to leverage its EMIB technology. Google’s ninth-generation TPU utilizes…
Viettel has become the first company in Qualcomm's 6G Early Access Program, signaling a significant partnership. While focused on 6G, the real impact lies…
Zhaoxin, a joint venture with VIA Technologies, holds a unique position as China's lone x86 chipmaker without U.S. sanctions. Despite being behind in technology,…
Hygon, a Chinese server chip manufacturer, evolved from a 2017 AMD EPYC architecture, leveraging a 2016 licensing deal. Despite U.S. sanctions halting new IP…
The Morefine M700S mini PC, powered by the Loongson 3A6000 processor, marks a significant achievement for Chinese silicon. Loongson's commitment to a self-designed ISA…
The article discusses the challenges faced by Chinese CPU companies due to reliance on foreign technology and sanctions. It outlines five key players navigating…
TSMC is raising prices across every node, even mature 7nm. Why this semiconductor cost reset is structural, what's driving it, and who bleeds most.
Keller welcomes the Cerebras IPO, then bets cheap DRAM and open RISC-V beat it on cost. The real prize is the CPU Qualcomm is…
AMD's acquisition of MEXT aims to address rising memory costs by enhancing flash storage capabilities, offering 2-4x effective capacity while reducing expenses. This strategic…
Qualcomm's Snapdragon X2 Elite shipped this spring and the reviews are in: up to 18 cores at 5.0 GHz, an 80 TOPS NPU, and…
Chiplets and UCIe are unbundling AI hardware the same way Modular unbundles CUDA. Why the moat doesn't vanish, it just relocates to TSMC's packaging…
The ASML lithography monopoly is the most complete chokepoint in tech. High-NA in fabs, Hyper-NA ahead, China capped, one company holding it all up.…
TSMC's A16 node brings backside power delivery (Super Power Rail) in 2026, answering Intel's 18A and opening the angstrom era for AI and HPC…
Intel showcased advancements in their 18A-P node at the VLSI Symposium, achieving enhanced performance and reduced power consumption. Key features include improved thermal resistance…