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TSMC CoWoS Outsourcing: Why Nvidia Broke the Packaging Line

AI · 08/05/2026

TSMC’s CoWoS Outsourcing Is Nvidia’s Fault, and the OSATs Saw It Coming First

TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…

4 MIN

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Huawei LogicFolding: stacked chip layers with hybrid bonding, achieving 238M Tr/mm² on 7nm DUV without EUV

CHIPS & AI · 07/17/2026

Huawei’s LogicFolding Architecture Reframes What a 7nm Foundry Can Actually Deliver

Huawei's LogicFolding uses 1.5µm hybrid bonding to hit 238M transistors/mm² on 7nm DUV — redefining what packaging can do without EUV.

6 MIN

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Chiplets: The New Modular AI Hardware Moat — m1k.tech article cover image featuring a glowing modular processor on a circuit board

AI · 06/24/2026

Chiplets and the Modular Turn: The AI Hardware Moat Is Quietly Coming Apart

Chiplets and UCIe are unbundling AI hardware the same way Modular unbundles CUDA. Why the moat doesn't vanish, it just relocates to TSMC's packaging…

6 MIN

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