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Besi stock down 6.4% as of October 2026, with price target nearly halved; ASML has not announced related downtime, per m1k.tech

CHIPS & AI · 10/12/2026

Besi Gets a Downgrade Over a Hybrid Bonder ASML Hasn’t Announced

Bank of America cut Besi to neutral on October 6 over a tool that so far exists only as a hint from ASML.

3 MIN

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Infographic: Xiaomi 18 Pro 5,999 yuan, 18 Pro Max 6,999 yuan, Extreme 18 Pro Max 7,999 yuan. Chart shows Snapdragon 8 Elite Gen 6 gains 18% raster performance using 14.6W (+49% power), Gen 6 Extreme gains 28% using 19.7W (+101% power) versus Gen 5 baseline of 9.8W, a 22% efficiency drop

CHIPS & AI · 09/24/2026

Snapdragon Summit 2026 Day 3: The Extreme Costs More in Yuan and in Watts

Xiaomi's 18 Pro launched at 5,999 yuan, 20% above last year's 17 Pro. A leaked benchmark chart, run on undisclosed phones, has the Extreme…

10 MIN

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Infographic: TSMC raising 2nm capacity from 90,000 to 110,000 wafers/month by mid-2027, and CoWoS packaging from 130,000 to 260,000 wafers/month by 2028, backed by $60-64B 2024 capex. Meanwhile chip stocks slide the same morning after Dario Amodei's AI caution: NVDA -4.71%, TSM -3.28%, ASML -3.65%, AMD -4.19%, as markets price in an AI slowdown despite strong foundry capacity signals

CHIPS & AI · 09/17/2026

TSMC Just Raised Its 2nm Capacity Guidance

TSMC plans to increase its 2nm capacity from 90,000 to 110,000 wafers monthly by mid-2027 and aims for significant growth in its 3nm and…

4 MIN

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Infographic on Kirin 9050 Pro's LogicFolding design: two silicon layers folded and bonded face-to-face with 50 million vertical interconnects at 1.5 micron pitch, achieving 238M transistors/mm2 via SMIC N+3 process without EUV, contrasted with Huawei Mate XT2 tri-fold phone. Text reads "Huawei Ran Out of Ways to Shrink It

CHIPS & AI · 09/07/2026

The Kirin 9050 Pro Is Folded in Half. Huawei Ran Out of Ways to Shrink It.

The Kirin 9050 Pro is the first chip built on Huawei's LogicFolding: two active silicon layers bonded face to face by 50 million vertical…

14 MIN

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Infographic: SK Hynix Indiana packaging campus assembles and tests HBM chips using DRAM wafers sourced from Icheon, Korea, not fabricated locally. Shows HBM supply chain steps, advanced packaging process, memory shortage timeline 2024-2027+, and groundbreaking ceremony. Key message: Indiana builds the package, Korea builds the memory

AI · 08/31/2026

SK Hynix’s Indiana Plant Won’t Make Memory

SK Hynix has initiated construction on a $4 billion factory in Indiana, intended for advanced memory chip packaging and AI semiconductor research. However, actual…

4 MIN

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Illustration of Xring O3 + O100 chip on a circuit board with glowing blue connections, labeled All-Big-Core + Hybrid Bonding

CHIPS & AI · 08/24/2026

The Xring O3 Has No Efficiency Cores. Xiaomi Says Daily Power Draw Fell 25% Anyway.

Xiaomi launched three chips at once: the Xring O3 with a ten-core all-big-core CPU and no efficiency cores, an O100 AI accelerator using hybrid…

10 MIN

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TSMC CoWoS Outsourcing: Why Nvidia Broke the Packaging Line

AI · 08/05/2026

TSMC’s CoWoS Outsourcing Is Nvidia’s Fault, and the OSATs Saw It Coming First

TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…

4 MIN

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