Snapdragon Summit 2026 Day 3 had no keynote, just receipts: Xiaomi's 18 Pro costs 20% more than last year, and early power data shows…
TSMC plans to increase its 2nm capacity from 90,000 to 110,000 wafers monthly by mid-2027 and aims for significant growth in its 3nm and…
The Kirin 9050 Pro is the first chip built on Huawei's LogicFolding: two active silicon layers bonded face to face by 50 million vertical…
SK Hynix has initiated construction on a $4 billion factory in Indiana, intended for advanced memory chip packaging and AI semiconductor research. However, actual…
Xiaomi launched three chips at once: the Xring O3 with a ten-core all-big-core CPU and no efficiency cores, an O100 AI accelerator using hybrid…
TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…
Huawei's LogicFolding uses 1.5µm hybrid bonding to hit 238M transistors/mm² on 7nm DUV — redefining what packaging can do without EUV.
Chiplets and UCIe are unbundling AI hardware the same way Modular unbundles CUDA. Why the moat doesn't vanish, it just relocates to TSMC's packaging…
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