Huawei Pulled the Ascend 960DT Forward Three Quarters. The Optics Matter More Than the Date.
Huawei's Ascend 960DT now lands in Q1 2027 and the 960PR in Q3, feeding a 4,096-NPU Atlas 960E SuperPoD built on near-packaged optics. The…
Huawei's Ascend 960DT now lands in Q1 2027 and the 960PR in Q3, feeding a 4,096-NPU Atlas 960E SuperPoD built on near-packaged optics. The…
China's Institute of Microelectronics reports a significant 500,000 on-off current ratio for a new gate-all-around transistor using deep ultraviolet lithography. However, this measure alone…
The Kirin 9050 Pro is the first chip built on Huawei's LogicFolding: two active silicon layers bonded face to face by 50 million vertical…
SMIC reported a Q2 net profit of $479.2 million, surpassing expectations, with revenue up 36 percent. While the firm is enhancing production to address…
Chemical mechanical planarization (CMP) is crucial for achieving sub-nanometer flatness in semiconductor manufacturing. Hwatsing Technology integrates metrology in its new tool to enhance efficiency…
Five years ago, creating a 7nm-class chip without EUV was deemed irrational. SMIC achieved it, but claims about its N+3 node density remain unverified.…
TSMC is expanding its CoWoS outsourcing to OSAT partners due to overwhelming demand, particularly from Nvidia. Despite doubling capacity, TSMC will still fall short…
JASM's Kumamoto fab reported a $29 million net profit in Q1 2026, rebounding from prior losses. This news, announced amidst production halts due to…
China's yuan-denominated integrated circuit exports surged 88.7% in early 2025, driven by global AI demand, though currency depreciation and outsourced assembly inflate figures. Despite…
China's first homegrown immersion DUV lithography tool order includes five machines this year and twenty next year. This development signals a shift in the…
Huawei recently unveiled its new laptop processors, Kirin X90 Plus and XE90, at a HarmonyOS event in China. The chips refine existing designs but…
Huawei's LogicFolding uses 1.5µm hybrid bonding to hit 238M transistors/mm² on 7nm DUV — redefining what packaging can do without EUV.
Huawei says folding chips in 3D routes around US sanctions. One month later IBM showed a validated 0.7nm nanostack, going further on better tools.…
By the end of 2025, Phytium shipped over 13 million processors, primarily to Chinese government entities, driven by mandates rather than market demand. Despite…
The Morefine M700S mini PC, powered by the Loongson 3A6000 processor, marks a significant achievement for Chinese silicon. Loongson's commitment to a self-designed ISA…
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