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AI Infrastructure

News on the AI infrastructure buildout: data centers, networking, fiber, power, and the physical backbone of artificial intelligence.

Infographic: TSMC raising 2nm capacity from 90,000 to 110,000 wafers/month by mid-2027, and CoWoS packaging from 130,000 to 260,000 wafers/month by 2028, backed by $60-64B 2024 capex. Meanwhile chip stocks slide the same morning after Dario Amodei's AI caution: NVDA -4.71%, TSM -3.28%, ASML -3.65%, AMD -4.19%, as markets price in an AI slowdown despite strong foundry capacity signals
CHIPS & AI · 09/17/2026

TSMC Just Raised Its 2nm Capacity Guidance

TSMC plans to increase its 2nm capacity from 90,000 to 110,000 wafers monthly by mid-2027 and aims for significant growth in its 3nm and…

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