TSMC's 1.4nm A14 node just entered pilot production ahead of internal schedule. Days later, Intel Foundry's CTO told investors 14A should land "within 5%"…
China's Institute of Microelectronics reports a significant 500,000 on-off current ratio for a new gate-all-around transistor using deep ultraviolet lithography. However, this measure alone…
Samsung's 2nm process has improved yield rates, surpassing 70 percent, yet Qualcomm remains hesitant to partner due to a 15 percent price hike by…
Kepler Computing, after seven years in stealth, claims to solve memory scarcity without extreme ultraviolet lithography. Backed by significant funding, the company utilizes a…
Three weeks after TSMC SVP Kevin Zhang opted against the High-NA EUV tool for the A14 node, TSMC announced a joint initiative with ASML…
UBS estimates that China's lithography technology is significantly behind, comparable to ASML in 2004, with no viable EUV alternative expected within a decade. However,…
The Kirin 9050 Pro is the first chip built on Huawei's LogicFolding: two active silicon layers bonded face to face by 50 million vertical…
TSMC's 3nm production is set to reach 180,000 wafers monthly by early Q4, ahead of schedule due to high demand from Nvidia, AMD, and…
Five years ago, creating a 7nm-class chip without EUV was deemed irrational. SMIC achieved it, but claims about its N+3 node density remain unverified.…
JASM's Kumamoto fab reported a $29 million net profit in Q1 2026, rebounding from prior losses. This news, announced amidst production halts due to…
China's yuan-denominated integrated circuit exports surged 88.7% in early 2025, driven by global AI demand, though currency depreciation and outsourced assembly inflate figures. Despite…
China's first homegrown immersion DUV lithography tool order includes five machines this year and twenty next year. This development signals a shift in the…
Huawei recently unveiled its new laptop processors, Kirin X90 Plus and XE90, at a HarmonyOS event in China. The chips refine existing designs but…
As of July 2026, Samsung and SK hynix reconsider hybrid bonding for HBM4 due to JEDEC's potential increase in stack height limits. This change…
ChangXin Memory Technologies (CXMT), founded in 2016, rapidly increased its DRAM wafer production, targeting around 240,000 monthly by 2025. With strong political backing and…
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