Qualcomm’s First 6G Partner Is Viettel, and the Clause That Matters Has Nothing to Do With 6G
Viettel has become the first company in Qualcomm's 6G Early Access Program, signaling a significant partnership. While focused on 6G, the real impact lies…
Semiconductor coverage, chipsets, AI platforms — Qualcomm, Snapdragon, MediaTek, NVIDIA, Intel and AI innovation.
Viettel has become the first company in Qualcomm's 6G Early Access Program, signaling a significant partnership. While focused on 6G, the real impact lies…
As of July 2026, Samsung and SK hynix reconsider hybrid bonding for HBM4 due to JEDEC's potential increase in stack height limits. This change…
Cristiano Amon announced that Samsung's Galaxy Watch 9 and Watch Ultra 2 now use Qualcomm's Snapdragon Wear Elite, marking a shift from Samsung's Exynos…
Memory chip prices pushed every Samsung foldable up $100 at Unpacked. The odd part is that Samsung sells the memory too, which makes this…
Samsung launched its new intelligent eyewear at Galaxy Unpacked in London, equipped with a Qualcomm Snapdragon AR1 Gen 1 processor, identifying competition from Meta's…
ChangXin Memory Technologies (CXMT), founded in 2016, rapidly increased its DRAM wafer production, targeting around 240,000 monthly by 2025. With strong political backing and…
The Snapdragon 8s Gen 3 pushed the flagship's on-device generative AI down a full price tier, and looking back from 2026 that quiet move…
Huawei's LogicFolding uses 1.5µm hybrid bonding to hit 238M transistors/mm² on 7nm DUV — redefining what packaging can do without EUV.
QTL is a sliver of Qualcomm's revenue that runs at margins the chip business can only dream about. It walked through antitrust regulators on…
Broadcom's $30 billion agreement with Apple, announced on July 7, 2026, ensures the production of custom silicon products through 2031. This commitment enhances Apple's…
MediaTek still sells more phone chips than anyone. By 2026 that's the least interesting thing about it: 3nm flagships, satellite NTN, and co-designing Google's…
Huawei says folding chips in 3D routes around US sanctions. One month later IBM showed a validated 0.7nm nanostack, going further on better tools.…
During the 2024 Paris Olympics, TDF and France Télévisions demonstrated 5G Broadcast, enabling simultaneous live streaming to multiple devices without data congestion. However, challenges…
KIOXIA's BiCS8 tops out at 218 layers, dead last among NAND makers. It also powers the 245.76TB LC9, the densest SSD on the planet.…
ASML from the Netherlands is the sole producer of advanced lithography machines essential for semiconductor manufacturing. xLight, led by Pat Gelsinger, aims to provide…