Huawei's Mate 60 Pro unexpectedly launched in 2023 featuring the Kirin 9000S chip, surprisingly circumventing US sanctions. HiSilicon, Huawei's silicon arm, encompasses its mobile,…
The article discusses the challenges faced by Chinese CPU companies due to reliance on foreign technology and sanctions. It outlines five key players navigating…
TSMC is raising prices across every node, even mature 7nm. Why this semiconductor cost reset is structural, what's driving it, and who bleeds most.
Keller welcomes the Cerebras IPO, then bets cheap DRAM and open RISC-V beat it on cost. The real prize is the CPU Qualcomm is…
In 2005, SMIC, China’s semiconductor champion, faced a dramatic journey, building advanced fabs with foreign technology while accumulating losses. Despite early successes and optimism…
As of June 2026, the RTX 5090's price has surged to $4,329, driven by high demand for its GDDR7 memory. While it boasts impressive…
Chiplets and UCIe are unbundling AI hardware the same way Modular unbundles CUDA. Why the moat doesn't vanish, it just relocates to TSMC's packaging…
The ASML lithography monopoly is the most complete chokepoint in tech. High-NA in fabs, Hyper-NA ahead, China capped, one company holding it all up.…
TSMC's A16 node brings backside power delivery (Super Power Rail) in 2026, answering Intel's 18A and opening the angstrom era for AI and HPC…
NVIDIA's B300 yields are stabilizing. That is not the story. The story is CoWoS: TSMC's packaging bottleneck that sits between Nvidia and the demand…
SMIC EUV does not exist and under current rules never will, and that single absence is the wall that decides whether China's foundry can…
Intel 14A uses High-NA EUV and may not be built at all unless outside foundry customers commit, the node where Intel Foundry either becomes…
Intel 18A brings RibbonFET and PowerVia backside power to Panther Lake, a genuine leadership feature, just as the CEO who bet everything on it…
Samsung 2nm, the SF2 node behind the Exynos 2600, is the company's comeback bid: a third-generation gate-all-around process against TSMC N2 and Intel.
TSMC's 2nm node brings gate-all-around nanosheets at last, three years after Samsung, into the first real leading-edge fight with Intel's 18A in a decade.